YANLING Industrial Computer Technology (Shenzhen) Co., Ltd
At YANLING, building an industrial computer is more than just assembly; it is an exercise in thermal physics and electrical resilience. Unlike consumer PCs, our systems are engineered to withstand 24/7 operation in extreme temperatures, high vibration, and dust-heavy environments. By integrating industrial-grade motherboards, high-conductivity heat sinks, and wide-voltage power protection, we deliver customized hardware that ensures zero downtime for automation, edge computing, and smart factory applications.
Component Category | YANLING Standard Specs | Key Characteristic |
CPU (Processor) | Intel Alder Lake N100 to 14th Gen Core i7 | Low TDP (6W-35W) for fanless cooling |
Chassis / Shell | High-Grade Aluminum Alloy (6063) | Finned design for passive dissipation |
Motherboard | Custom Industrial-Grade PCB | Solid capacitors, 5–8 year lifecycle |
Memory (RAM) | DDR4 / DDR5 (Up to 4800MHz) | Industrial-grade, high-temperature resistance |
Storage | M.2 NVMe / mSATA / 2.5" SATA | Anti-vibration, shock-resistant SSDs |
Network Interface | Intel I226-V / I211-AT | 2.5G/1G Dual or Multi-LAN ports |
Communication I/O | RS232/RS485, GPIO, CAN Bus | ESD and Surge protection integrated |
Power Module | Wide Voltage (DC 9V–36V) | Over-voltage & Reverse-polarity protection |
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Acts as the "Lungs" of the system. The finned exterior maximizes surface area to dissipate heat away from the CPU without needing a mechanical fan, effectively sealing the PC against dust.
Unlike consumer boards that may fail under constant heat, our boards use high-quality solid capacitors and thicker copper layers to ensure electrical stability and a long operational lifespan.
Industrial environments often have unstable power grids. Our DC-to-DC modules handle wide voltage ranges, ensuring the computer isn't fried by sudden surges or drops.
Specifically chosen for low latency and high reliability, these chips facilitate rapid communication between the PC and industrial PLCs or high-resolution cameras.
Allows for customization. Users can add 4G/5G modules for remote sites or specialized WiFi/Bluetooth cards for factory connectivity.
To ensure every unit meets "Top Industrial Grade" standards, we follow a strict six-stage production flow:
Based on client needs (e.g., I/O requirements like 6x COM ports), our engineers design the PCB layout. We ensure the layout optimizes heat distribution and minimizes electromagnetic interference (EMI).
Surface Mount Technology (SMT) machines place high-precision components onto the PCB. We use lead-free soldering and conduct an Automatic Optical Inspection (AOI) to check for any soldering defects at the micron level.
The heart of the fanless build. We apply high-performance thermal grease or thermal pads to the CPU, then secure it directly to the aluminum thermal block connected to the external chassis. This ensures the shortest possible path for heat escape.
The motherboard is secured into the aluminum enclosure. Custom I/O cables (COM, LAN, USB) are routed and secured with industrial-grade adhesives or clips to ensure they do not vibrate loose during transportation or factory use.
Every YANLING computer undergoes a 48 to 72-hour aging test. We run the CPU at 100% load inside a high-temperature chamber to ensure the fanless design can handle the heat without crashing or "throttling" performance.
The final stage involves testing every single port (COM, HDMI, LAN) for signal integrity. Once it passes IP-rating tests (dust/moisture) and electrical safety checks, the unit is packed in anti-static materials for global shipping.
